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Wet Process Equipment - List of Manufacturers, Suppliers, Companies and Products

Wet Process Equipment Product List

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Wet Process Equipment K-150/200

Wet Process Equipment K-150/200

Wet process equipment K-150/200 (coating, developing, etching, stripping, cleaning)

The "K" series features new technologies and functions. It is an expandable wet processor that allows for easier and lower-cost upgrades to new workflows. It can be customized for any specifications in wet processes such as resist coating, developing, etching, stripping, and cleaning. We will develop the necessary functions through discussions with our customers, ensuring that we provide optimal equipment at a low cost without excessive specifications. Additionally, since both design and manufacturing are done in-house, we can respond quickly to specification changes after the equipment is installed.

  • Other process controls

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Wet process equipment "BATCHSPRAY Acid"

Wet process equipment "BATCHSPRAY Acid"

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimal installation area, and optimized space efficiency. 【Features】 ■ Throughput of up to 150 wph ■ Uniformity with less than 1% variation ■ Installation area of less than 2 m² ■ Chemical recirculation through a tank system ■ Process executable with SiC/GaN ■ Usable with chambers for 25 or 50 wafers ■ Extractable process chamber *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment

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New type UDS spin sheet device (etching, RCA, cleaning, developing, etc.)

New type UDS spin sheet device (etching, RCA, cleaning, developing, etc.)

Significant reduction in footprint and purchase costs, increased throughput, and substantial improvement in substrate quality.

- Suitable for various WET processes such as etching, RCA cleaning, and developing. - A full process of "chemical solution ⇒ rinse ⇒ drying" is handled in a single chamber with Dry-In/Dry-Out. - Conventional method: 2-chamber configuration (the substrate remains in contact with the chemical solution during transfer between chambers). - New method: UDS type uses a 1-chamber configuration. - Basic operation of the substrate: - "Upper section… Substrate LD" ⇒ "Lower section… Chemical treatment" ⇒ - "Middle section… Rinse drying" ⇒ "Upper section… Substrate ULD" - The patented isolation plate ensures the concentration of the chemical solution during reuse. - There is no dilution from rinse water contamination. - For example, it can accommodate "Lower section… SPM treatment" and "Middle section… APM/MS." - The patented isolation plate completely separates and prevents the scattering of chemical gases and mists in the lower treatment section. - Chemical solution/rinse treatment can be performed on the backside of the substrate, ensuring it is contamination-free. - Shortening the manufacturing process significantly increases production efficiency and can greatly reduce cleanroom occupancy area. - A seamless process of etching ⇒ stripping is possible within a single system device. *For more details, please refer to the PDF document or feel free to contact us.*

  • Other semiconductor manufacturing equipment

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